Bell Circuits' Technology

• Volume production process technology for HDI printed circuit boards
• Volume production process technology for high layer count printed circuit boards (5.00 mm thickness)
• Heavy copper (6 oz./210 ƒÊm), etching and lamination technology
• Innovative process technology for low cost highly reliable rigid-flexible printed circuit boards
• Volume production process technology for utilizing low dielectric materials
• System in package (SiP) design technology
• System in package (SiP) testing and verification simulation technology